Main product

Overview


Fierce DDR5 Performance

Delivers up to 6000MT's1 with timing as low as CL32 for a next-gen experience.

Durable, Heat-Dissipating Design

The all-new THOR design features a 1.6mm thick durable heatsink in solid aluminum for superior heat dissipation.

Low-Profile Form Factor

At a mere 40mm high, this memory is perfect for compact PC builds.

Improved Stability, Reliability, and Efficiency

on-die Error Correction Code (ECC) for improved stability and reliability and on-board Power Management Integrate Circuits (PMIC) to enhance power efficiency.

Seamlessly Compatible

Supports Intel XMP 3.0 and AMD EXPOTM overclocking and is compatible with mainstream DDR5 motherboards.

Rigorously Tested

All Lexar products undergo extensive testing in the Lexar Quality Labs, facilities with thousands of different cameras and digital devices to ensure performance, quality, compatibility, and reliability.




At-a-glance


  • Heat-Dissipating Design

  • Overclocked Performance

  • Stability and Reliability

  • Support XMP 3.0 & EXPOTM




Reasons to buy

  • Heat-Dissipating Design
  • Overclocked Performance
  • Stability and Reliability
  • Support XMP 3.0 & EXPOTM

Specification

Technical Description: Lexar LD5U16G60C32LG-RGD memory module 32 GB 2 x 16 GB DDR5 6000 MHz ECC
Features
Cooling type:The method used to cool the device or to cool the air around the device.
Heatsink
Intel Extreme Memory Profile (XMP) version:
3.0
Intel Extreme Memory Profile (XMP):
Yes
Memory voltage:The voltage (V) of the memory in the device.
1.35 V
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
32
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Yes
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Component for:What this product is used as a part of (component for).
PC
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
6000 MHz
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR5
Memory layout (modules x size):
2 x 16 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
32 GB

General
Type:Characteristics of the device.
Memory RAM

Operational conditions
Storage temperature (T-T):The minimum and maximum temperatures at which the product can be safely stored.
-55 - 100 °C
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
0 - 85 °C

Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
40.8 mm
Depth:The distance from the front to the back of something.
7.6 mm
Width:The measurement or extent of something from side to side.
138.3 mm

Product details

LD5U16G60C32LG-RGD Lexar 0843367132621

Lexar LD5U16G60C32LG-RGD memory module 32 GB 2 x 16 GB DDR5 6000 MHz ECC

£113.99 and In stock

SKU: LD5U16G60C32LG-RGD

Lexar LD5U16G60C32LG-RGD memory module 32 GB 2 x 16 GB DDR5 6000 MHz ECC

Quick Code: Q830706 MPN: LD5U16G60C32LG-RGD

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Key Features

  • Overclocked Performance
  • Heat-Dissipating Design
  • Support XMP 3.0 & EXPOTM
  • Stability and Reliability