Main product

Overview


Netac Basic DDR4
Original chips improve the performance of computer

Selected original chips, strict inspection process, 8-layer PCB board, stable performance

Excellent compatibility
Memory products have passed the motherboard compatibility test of mainstream brands on the market, ensure the stability of the system for along time

Gold-plated craft gold finger
Gold plating process, stronger conductivity and corrosion resistance




At-a-glance


  • 8 bit pre-fetch

  • Command/Address (CA) parity

  • Command/Address latency (CAL)

  • Data bus inversion (DBI) for data bus

  • Databus write cyclic redundancy check (CRC)

  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)

  • Fly-by topology

  • Gold edge contacts

  • Low-power auto self refresh (LPASR)

  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals

  • On-board I2C serial presence-detect (SPD) EEPROM

  • On-die VREFDQ generation and calibration

  • PCB: Height 1.23” (31.25mm)

  • Per DRAM Addressability is supported

  • RoHS Compliant and Halogen-Fre

  • Selectable BC4 or BL8 on-the-fly (OTF)

  • Temperature controlled refresh (TCR)

  • Terminated control command and address bus




Reasons to buy

  • 8 bit pre-fetch
  • Command/Address (CA) parity
  • Command/Address latency (CAL)
  • Data bus inversion (DBI) for data bus
  • Databus write cyclic redundancy check (CRC)
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
  • Fly-by topology
  • Gold edge contacts
  • Low-power auto self refresh (LPASR)
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • On-board I2C serial presence-detect (SPD) EEPROM
  • On-die VREFDQ generation and calibration
  • PCB: Height 1.23” (31.25mm)
  • Per DRAM Addressability is supported
  • RoHS Compliant and Halogen-Fre
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Temperature controlled refresh (TCR)
  • Terminated control command and address bus

Specification

Technical Description: Netac Basic DDR4-3200 8G C16
Features
Lead plating:
Gold
Programming power voltage (VPP):
2.5 V
SPD profile:
Yes
Intel Extreme Memory Profile (XMP):
Yes
Memory voltage:The voltage (V) of the memory in the device.
1.35 V
Memory channels:
Single-channel
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
3200 MHz
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
16
ECC:ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
No
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Component for:What this product is used as a part of (component for).
PC/Server
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR4
Memory layout (modules x size):
1 x 8 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
8 GB
Buffered memory type:
Unregistered (unbuffered)

General
Type:Characteristics of the device.
Memory RAM

Operational conditions
Storage temperature (T-T):The minimum and maximum temperatures at which the product can be safely stored.
-55 - 100 °C
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
0 - 85 °C

Sustainability
Doesn't contain:
Halogen

Technical details
Compliance certificates:
RoHS

Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
31.2 mm
Width:The measurement or extent of something from side to side.
133.3 mm

Product details

NTBSD4P32SP-08 NETAC

Netac Basic DDR4-3200 8G C16

£23.76 and In stock

SKU: NTBSD4P32SP-08

Netac Basic DDR4-3200 8G C16

Quick Code: Q242710 MPN: NTBSD4P32SP-08

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Key Features

  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • On-board I2C serial presence-detect (SPD) EEPROM
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Databus write cyclic redundancy check (CRC)