Main product

Overview


Thermal compund (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive




At-a-glance


  • Keep your computer's CPU cool

  • Practical syringe for easy application




Reasons to buy

  • Keep your computer's CPU cool
  • Practical syringe for easy application

Specification

Technical Description: Gembird TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g
Features
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
-50 - 240 °C
Thermal resistance:
0.205 °C/W
Viscosity note:
76 CPS
Product colour:
Grey
Thermal conductivity:Thermal conductivity is the property of a material to conduct heat.
4.5 W/m·K

Packaging data
Package weight:Weight of the packaged product.
33 g
Package height:The distance from the top to the bottom of the packaging.
15 mm
Package depth:The distance from the front to the back of the packaging.
180 mm
Package width:The distance from one side of the packaging to the other.
120 mm

Technical details
Compliance certificates:
RoHS

Weight & dimensions
Weight:Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
3 g
Height:The measurement of the product from head to foot or from base to top.
15 mm
Depth:The distance from the front to the back of something.
180 mm
Width:The measurement or extent of something from side to side.
120 mm

Product details

TG-G3.0-01 Gembird 8716309083133

Gembird TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g

£10.00 and In stock

SKU: TG-G3.0-01

Gembird TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g

Quick Code: Q1900066 MPN: TG-G3.0-01

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Key Features

  • Keep your computers CPU cool
  • Practical syringe for easy application